Ceramic PCB

Ceramic PCB Manufacturer — AlN & Alumina Ceramic Circuit Boards

FX PCB manufactures ceramic printed circuit boards in Shenzhen, China, for designs where FR4 cannot handle the heat, power density, or operating temperature. We produce ceramic PCBs with DPC (Direct Plate Copper) technology — the process we use for all ceramic orders — on aluminum nitride (AlN) and alumina (Al2O3) substrates, from prototypes to mass production. Send us your Gerber files and requirements, and our engineers will review them and return a quote in 1–2 working days. Get a Quote

Why Choose a Ceramic PCB?

• Heat dissipation: ceramic substrates conduct heat far better than organic laminates — AlN reaches a thermal conductivity of ≥170 W/(m·K).
• High temperature & insulation: strong electrical insulation and stable performance at high operating temperatures.
• Low high-frequency loss: low dielectric constant and low dielectric loss for RF and high-frequency designs.
• Reliability: no organic ingredients in the substrate, a coefficient of thermal expansion close to silicon, and a long service life in harsh environments.

Ceramic Materials We Work With

Aluminum Nitride (AlN)

For high-power and high-heat designs. Key properties: thermal conductivity ≥170 W/(m·K), dielectric constant 8–10 (1 MHz), dielectric strength ≥17 kV/mm, flexural strength ≥450 MPa. Our ceramic materials are imported from Germany and Fujian Huaqing, and every incoming batch is strictly checked. AlN Ceramic PCB For reference, the AlN we supply (thicknesses of 0.38–1.5 mm):

Property	Value
Thermal conductivity (20 °C)	≥170 W/(m·K)
Density	≥3.33 g/cm³
Flexural strength	≥450 MPa
Volume resistivity	≥10¹³ Ω·cm
Dielectric constant (1 MHz)	8–10
Dielectric loss (1 MHz)	≤4.5×10⁻⁴

Alumina (Al2O3)

A cost-effective ceramic for LED, thick-film, and general high-temperature applications. Alumina Ceramic PCB Alumina is the most widely used ceramic PCB substrate. It costs less than AlN while still moving heat far better than an organic laminate, which makes it the default choice when the thermal load is moderate rather than extreme. Properties of the alumina we supply (Al2O3 content ≥96%, supplied in thicknesses of 0.25–2.0 mm):

Property	Value
Al2O3 content	≥96%
Thermal conductivity (20 °C)	≥20 W/(m·K)
Dielectric constant (1 MHz)	9–10
Dielectric loss (1 MHz)	≤3×10⁻⁴
Dielectric strength	≥17 kV/mm
Flexural strength	≥350 MPa
Density	≥3.7 g/cm³
Thermal expansion (20–300 °C)	6.5–7.5 ×10⁻⁶/K
Volume resistivity	≥10¹⁴ Ω·cm
Water absorption	0%

In practice: pick alumina for LED boards, thick-film circuits, and power or high-temperature designs where a thermal conductivity of ≥20 W/(m·K) is enough; move up to AlN when the heat flux is higher or the design needs a thermal expansion closer to silicon.

Processes

DPC is our standard for ceramic orders. We also supply thick-film ceramic PCBs and laser-cut ceramic substrates. Thick Film Ceramic PCB · DPC Ceramic PCB · Laser-Cut Ceramic

Ceramic PCB Processes: DPC, DBC, Thick Film, LTCC and HTCC

“Ceramic PCB” is made by several different processes, and the process decides the line resolution, copper thickness, and cost of the finished board. The five names you will see most often: DPC (Direct Plate Copper) — our standard process. A thin-film seed layer is vacuum-deposited (PVD) onto the ceramic, and the circuit copper is then electroplated directly on the substrate. Track width and space depend on the copper thickness: 0.05/0.05 mm with thin copper (5–10 µm), 0.075/0.075 mm at 0.5 oz, and 0.1/0.1 mm at 1 oz. Plated copper runs from 2–300 µm, boards go up to 138 × 190 mm with a size tolerance of ≤±50 µm, and via filling is available at aspect ratios up to 5:1 on boards up to 0.635 mm thick. It is the right process for fine-pitch designs, high-power LED boards, and RF layouts. We use DPC for all ceramic PCB orders. DBC (Direct Bonded Copper) — thick copper foil is bonded to the ceramic at high temperature. DBC carries very high current and is common under power semiconductor modules, but its etched patterns are coarser than DPC, so it suits power layouts rather than fine-pitch circuits. Thick film — conductor pastes are screen-printed onto the ceramic and fired. Thick film is economical for simpler circuits and is a long-established route for heater and resistor networks. We also supply thick-film ceramic PCBs. LTCC (Low-Temperature Co-Fired Ceramic) — layers of ceramic tape are printed, stacked, and co-fired into one multilayer block, which allows embedded passive components and three-dimensional structures. It is a different cost and lead-time profile from a plated board. HTCC (High-Temperature Co-Fired Ceramic) — the same co-fired idea at higher temperatures with refractory-metal conductors, used mainly for hermetic packages. If your current design is specified on DBC or LTCC and you are considering a move, send us the files — our engineers review every design before quoting and will tell you honestly whether DPC can build it.

Ceramic PCB Capability

Board thickness	0.25 / 0.38 / 0.5 / 0.635 / 1.0 / 1.5 / 2.0 / 2.5 / 3.0 mm
Layers	1–2
Base copper thickness	18–300 µm (0.5–8.5 oz)
Min. track width / space	0.075 mm
Min. hole size	0.06 mm (PTH)
Surface finish	ENIG, ENEPIG, Immersion Silver
Materials	AlN, Al2O3

How We Make Ceramic PCBs

Every ceramic board we ship goes through the same controlled process:

1. IQC (incoming inspection) — every batch of ceramic material is strictly checked on arrival before it enters production.
2. Laser drilling — holes are drilled by laser, which ceramic’s hardness makes the practical route. Laser hole size depends on board thickness: 0.1 mm holes in 0.25–0.5 mm boards, 0.2–0.35 mm at 1.0 mm thickness, and 0.5–0.6 mm at 2.0 mm, with a minimum hole-to-hole edge spacing of 0.15 mm.
3. PVD — a thin metal seed layer is vacuum-deposited onto the ceramic surface; this is the step that lets copper bond directly to the substrate in the DPC process.
4. Plating — the circuit copper is electroplated up to the specified thickness, anywhere in our 2–300 µm DPC range, including plated via filling at aspect ratios up to 5:1.
5. Pattern and etching — the circuit image is transferred and etched, holding track width and space down to 0.05/0.05 mm with thin copper (5–10 µm), or 0.075/0.075 mm at 0.5 oz copper.
6. QC inspection — the patterned panels are inspected before they move on.
7. Solder mask and silkscreen — protective coating and legend are applied.
8. Surface treatment — your choice of OSP (0.2–0.5 µm), immersion silver (≥0.5 µm), immersion tin (0.8–1.2 µm), immersion gold (Ni 3–8 µm / Au 0.03–0.3 µm), or ENEPIG (Ni 3–8 µm / Pd 0.05–0.1 µm / Au 0.05–0.1 µm).
9. Testing — every board is 100% tested before shipment.
10. Laser CNC profiling — boards are cut to outline by laser, which suits ceramic’s brittleness better than mechanical routing.
11. FQC and packing — final quality check, then packed for shipment.

Ceramic PCB vs FR4 vs Metal-Core PCB

How does a ceramic substrate compare with the two boards it usually replaces?

Property	Ceramic (AlN)	Ceramic (Alumina)	FR4	Metal-Core (MCPCB)
Thermal conductivity	≥170 W/(m·K)	≥20 W/(m·K)	Very low — heat stays trapped in the laminate	Moderate — the metal base spreads heat, but the thin dielectric layer under the copper limits how fast heat gets there
Thermal expansion vs silicon	2–3 ×10⁻⁶/K — very close to silicon	6.5–7.5 ×10⁻⁶/K	Much higher than silicon, so joints see more stress over temperature cycles	Set by the metal base rather than the circuit layer
High-frequency loss	Very low dielectric loss	Low	Higher loss, rises with frequency	Similar to its dielectric layer
Operating temperature	Highest of the three — no organic material in the substrate	Highest of the three — no organic material in the substrate	Limited by the resin	Limited by the dielectric layer
Mechanical character	Strong but brittle — handle as a ceramic, not a laminate	Strong but brittle	Tough and forgiving	Tough, can be bent before assembly
Relative cost	Highest	Mid–high	Lowest	Mid

The short version: choose ceramic when the design’s heat, power density, or operating temperature is what makes FR4 or MCPCB fail — not as a default upgrade.

What Does a Ceramic PCB Cost?

Ceramic PCB pricing depends mainly on the substrate material (AlN costs more than Al2O3), board size and thickness, copper thickness, and quantity. Send us your files and we will quote your exact design in 1–2 working days — no obligation.

What Our Customers Say

★★★★★ Clement “This was my first time ordering a ceramic PCB, and Nora was patient and professional with me while I was figuring everything out. I was extremely impressed by the quality of the product compared to other PCB fabs I’ve used in the past, and their pricing on aluminum nitride PCBs is excellent. The custom PCBs I received are exactly what I wanted, and came packed really well. Highly recommended!”

Applications

Ceramic PCBs are used primarily in LED lighting and other high-power, high-temperature, and high-frequency applications where thermal performance decides product life.

LED Lighting and High-Power LED Modules

The largest use of ceramic PCBs. In a high-power LED, most of the input energy leaves as heat through the board, and junction temperature decides both brightness maintenance and service life. Alumina is the standard substrate for LED boards; AlN takes over for the highest-power modules. Ceramic also suits COB (chip-on-board) LED assemblies, where the die sits almost directly on the substrate.

Power Electronics and Power Modules

High-power semiconductor modules, power control circuits, and power hybrid circuits generate concentrated heat that an organic laminate cannot move fast enough. Ceramic substrates carry that heat into the heatsink while keeping high-voltage insulation — the same combination used in AC converters, switch regulators, and high-frequency switching power supplies.

Automotive Electronics

Automotive power control modules work in hot, vibrating, long-life environments where consumer-grade boards age quickly. Ceramic’s temperature stability and insulation are why it appears in automotive power stages and other under-hood electronics.

RF, Microwave and Communications

Ceramic’s low dielectric constant and low dielectric loss keep high-frequency signals clean, which is why ceramic boards are used in communication antennas and other RF and high-frequency designs where FR4’s loss becomes the limiting factor.

Lasers, IC Packaging and Thermal Modules

Laser modules, IC packages, semiconductor coolers (TEC), and electronic heaters all share one requirement: a substrate that moves heat in a controlled direction without giving up electrical insulation. Ceramic’s combination of thermal conductivity and insulation makes it the standard carrier for these parts.

FAQ

What is a ceramic PCB? A printed circuit board built on a ceramic substrate (such as AlN or Al2O3) instead of an organic laminate like FR4, chosen for heat dissipation, insulation, and high-temperature reliability. DPC, DBC, LTCC, HTCC — which do you use? We use DPC for all ceramic PCB orders: copper is plated directly onto the ceramic, giving high thermal conductivity and fine, smooth traces. Can you assemble components on ceramic boards? Yes — we offer PCB assembly alongside fabrication; send your BOM with your Gerber files for a turnkey quote. Q4. AlN or alumina — which one should I choose? It comes down to heat. AlN conducts heat at ≥170 W/(m·K), alumina at ≥20 W/(m·K). If your design’s heat flux is moderate, alumina does the job at a lower material cost; if you are pushing high power density, or need a thermal expansion close to silicon (AlN: 2–3 ×10⁻⁶/K), AlN is worth the premium. Send us your design and our engineers will recommend one before quoting. Q5. How many layers can a ceramic PCB have? Our DPC ceramic boards are 1–2 layers, on board thicknesses from 0.25 to 3.0 mm. Most ceramic designs — LED boards, power substrates, RF carriers — are single or double-sided by nature; if your design needs more layers, talk to us before layout and we will look at the options with you. Q6. What copper thickness and line width can you achieve? Plated copper from 2–300 µm. Track width and space depend on the copper thickness: 0.05/0.05 mm with thin copper (5–10 µm), 0.075/0.075 mm at 0.5 oz, and 0.1/0.1 mm at 1 oz. Laser-drilled holes start at 0.1 mm on thin boards (0.25–0.5 mm). Surface finishes are OSP, immersion silver, immersion tin, immersion gold (ENIG), and ENEPIG. Q7. What does a ceramic PCB cost? More than the same board in FR4 — the substrate itself is the main reason, and AlN costs more than Al2O3. Beyond material, price is driven by board size and thickness, copper thickness, and quantity, as explained in our cost section above. There is no meaningful “standard price” for a custom board, so send your files and we will quote your exact design in 1–2 working days. Q8. Can I order prototypes, or only mass production? Both. We produce ceramic PCBs from prototypes to mass production, so you can validate a design on a small run before committing to volume. Q9. What do you need from me to quote a ceramic PCB? Your Gerber files and your requirements (material, thickness, copper, finish, quantity). Our engineers review them and return a quote in 1–2 working days. If you also want assembly, add your BOM — see the assembly question above. Q10. Which surface finish should I choose for a ceramic board? We offer OSP, immersion silver, immersion tin, immersion gold (ENIG), and ENEPIG. ENIG is the common default for soldering; ENEPIG is often chosen when wire bonding is part of the assembly; immersion silver suits high-frequency designs; OSP and immersion tin are economical options for straightforward assembly. If you are unsure, tell us how the board will be assembled and we will match the finish.