CERAMIC PCB

FX PCB can provide the ALN(Aluminum oxide) and AIO203(Aluminum Nitride) Ceramic PCB, we can make ENEPIG, ENIG, Immerison silver surface,you can check the material datesheet and our capability from the below tables.

Ceramic PCB is actually made of electronic ceramic materials and can be made into various shapes.

The ceramic circuit board has the following characteristics: high-temperature resistance, high electrical insulation, low dielectric constant, low dielectric loss, high thermal conductivity, good chemical stability, and the thermal expansion is almost can be coefficients of components.

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Description

What are the Ceramic PCB materials Properties?

FX PCB listed two Ceramic PCB material(ALN and AIO203) Properties for your reference:

Aluminum Oxide(AI203) is the most popular ceramic material for the Ceramic PCB, as the high thermal conductivity, low roughness, low expansion. Meanwhile, the cost is cheaper than the ALN and BeO And keep the AI203 materials properties table below:

CERAMIC PCB AIO203 Materials datesheet:

Item Unit Value Test Standard
Color / White 3.2
Density g/cm³ ≥ 3.7 GB/T 2413
Thermal Conductivity 20℃, W/(m • K) ≥ 24 GB/T 5598
Dielectric Constant 1MHz 9~10 GB/T 5594.4
Dielectric Strength KV/mm ≥ 17 GB/T 5593
Flexural Strength Mpa ≥ 350 GB/T 5593
Camber Length‰ ≤2‰
Surface Roughness Ra µ m 0.2~0.75 GB/T 6062
Water Absorption % 0 GB/T 3299—1996
Volume Resistivity 20℃, Ω .cm ≥ 1014 GB/T 5594.5
Thermal Expansion 10-6 mm 20~300℃ 6.5~7.5 GB/T 5593

 

Even the cost for ALN will be more expensive than the AIO203, ALN has the high conductivity and the expansion coefficient matching Si, which makes the customers still choose it as the material for their products, Here you can see the details for the ALN material properties.

ALN MATERIAL DATESHEET:

Item Unit Value Test Standard
Color / Gray 3.2
Density g/cm³ ≥ 3.33 GB/T 2413
Thermal Conductivity 20℃, W/(m • K) ≥ 170 GB/T 5598
Dielectric Constant 1MHz 8~10 GB/T 5594.4
Dielectric Strength KV/mm ≥ 17 GB/T 5593
Flexural Strength Mpa ≥ 450 GB/T 5593
Camber Length‰ ≤2‰
Surface Roughness Ra µ m 0.3~0.6 GB/T 6062
Water Absorption % 0 GB/T 3299—1996
Volume Resistivity 20℃, Ω .cm ≥ 10¹³ GB/T 5594.5
Thermal Expansion 10-6 mm 20~300℃ 2~3 GB/T 5593

What’s kind of fields that the Ceramic PCB can be used?

Ceramic printed circuit boards are mostly used in the LED field, high-power semiconductor modules, semiconductor coolers, electronic heaters, power control circuits, power hybrid circuits, components, high-frequency switching power supplies, automotive electronics, communications, aerospace, and military electronic components

What’s the FX PCB Ceramic PCB capability

Board Thickness(mm) 0.25/0.38/0.5/0.635/1.0/1.5/2.0/2.5/3.0mm
Layer Number 1-2L
Base copper thickness(um) 18-300um(0.5-8.5oz)
Min Track width/space(mm) 0.075mm
Min hole size 0.06mm(PTH)
Finished hole tolerance(mm) 0.05mm(NPTH)
Outline Tolerance(mm) 0.05mm
Hole Tolerance +/-0.05mm
Min space from track to board edge 0.2mm
  Finished board thickness (0.25-0.38mm)+/-0.03mm
(0.38-0.635)+/-0.04mm
(0.76-2mm)+/-0.05mm
Surface Treatment ENIG,ENEPIG,Immersion Silver
Material AIN, AI203

 

The customer used it in the communication Antenna, Automotive power control modules, AC converters, lighting system, Switch regulators, High-power LEDs, Laser, IC package and etc.

Ceramic VS Fr4 material, what is the advantage?

  1. Higher thermal conductivity
  2. Better thermal expansion
  3. Stronger and lower resistance metal film
  4. Good solderability of the substrate and high operating temperature 5, Good insulation and Low High-frequency loss
  5. High-density assembly possible
  6. It has a long life and high reliability in aerospace as it does not contain the organic ingredients and resistant to the cosmic rays
  7. The copper layer does not contain an oxide layer

What’s kind of PCB files FX PCB can accept?

Gerber file, Cam, Eagle file, CAD, Protel99, 99se, DXP, Pabs

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