Ceramic PCB Capability:

Board Thickness(mm)       0.25/0.38/0.5/0.635/1.0/1.5/2.0/2.5/3.0mm
Layer Number     1-2L
Base copper thickness(um) 18-300um(0.5-8.5oz)
Min Track width/space(mm)  0.075mm
Min hole size 0.06mm(PTH)
Finished hole tolerance(mm) 0.05mm(NPTH)
Outline Tolerance(mm) 0.05mm
Hole Tolerance    +/-0.05mm
Min space from track to board edge 0.2mm
 

Finished board thickness

 (0.25-0.38mm)+/-0.03mm
(0.38-0.635)+/-0.04mm
(0.76-2mm)+/-0.05mm
Surface Treatment ENIG,ENEPIG,Immersion Silver
Material AIN, AI203

ALN Material Datesheet:

Item Unit Value Test Standard
Color / Gray 3.2
Density g/cm³ ≥ 3.33 GB/T 2413
Thermal Conductivity 20℃, W/(m · K) ≥ 170 GB/T 5598
Dielectric Constant 1MHz 8~10 GB/T 5594.4
Dielectric Strength KV/mm ≥ 17 GB/T 5593
Flexural Strength Mpa ≥ 450 GB/T 5593
Camber Length‰ ≤2‰
Surface Roughness Ra µ m 0.3~0.6 GB/T 6062
Water Absorption % 0 GB/T 3299—1996
Volume Resistivity 20℃, Ω .cm ≥ 10¹³ GB/T 5594.5
Thermal Expansion 10-6 mm      20~300℃ 2~3 GB/T 5593

AIO 203 Materials Properties:

Item Unit Value Test Standard
Color / White 3.2
Density g/cm³ ≥ 3.7 GB/T 2413
Thermal Conductivity 20℃, W/(m · K) ≥ 24 GB/T 5598
Dielectric Constant 1MHz 9~10 GB/T 5594.4
Dielectric Strength KV/mm ≥ 17 GB/T 5593
Flexural Strength Mpa ≥ 350 GB/T 5593
Camber Length‰ ≤2‰
Surface Roughness Ra µ m 0.2~0.75 GB/T 6062
Water Absorption % 0 GB/T 3299—1996
Volume Resistivity 20℃, Ω .cm ≥ 1014 GB/T 5594.5
Thermal Expansion 10-6 mm    20~300℃ 6.5~7.5 GB/T 5593

FX PCB use the ceramic material imported from Germany and Fujian Huaqing, all incoming material will be strictly checked for the material properties. See the capability of FX PCB for the Ceramic.