Glass PCB 1
The glass substrate has unique advantages in the flatness, transparent, deformation, heat resistance, tear resistance and etc, the deformation rate is very low under the high temeprature working for long time, the glass PCB can 360 degree luminescence, 80 color rendering index can be 140lmw or more, it don’t need to add the heat sink, and there is no light attenuation. Currently the glass PCB widely used in the LED display, solar, 3D printer and etc.
FX PCB developed his own technology on the glass PCB, which can greatly improve the copper thickness and adhesivity on the glass, please see FX PCB capability, and the advantage compared to other glass PCB technlogy.
|Base copper thickness(um)||6-35um|
|Min Track width||100um+/-20um|
|Min hole size||2.0mm|
|Surface Treatment||OSP, Immersion silver|
|Material||Tempered low iron glass; Float glass; Sapphire crystal glass; Quartz glass|
Glass PCB Technology Compare:
|Technology||Copper plating||Track Technology||Track precision||Copper Adhesivity||Yield||Copper thickness|
|Thick film||Stencil||silkscreen||Not clear,poor surface smooth||Poor(1.0)||High(80-95%)||10-25um|
|Thin Film||Vacumn plating||Etching||High Precision, surface smooth||Poor(0.7)||Low(50%-70%)||6-12um|
|FX PCB||Own technology||Etching||High precision, surface smooth||Strong(2.5)||High(80%-95%)||6-35um|