Fr4 PCB Capability:

Item Process Capability
Layer Counts 1-24L
Material FR-4,Ceramic,Alu Base, Cu Base, Rogers,etc.
Maximum Size 600mm x 1500mm
Board Outline Tolerance ± 0.10mm
Board Thickness 0.20mm—8.00mm
Thickness Tolerance(t ≥ 0.8mm) ± 8%
Thickness Tolerance(t < 0.8mm) ± 10%
Insulation Layer Thickness 0.075mm—5.00mm
Minimum Line 0.075mm
Minimum Space 0.075mm
Out Layer Copper Thickness 18um—350mm
Inner Layer Copper Thickness 17um—210mm
Drilling Hole(Mechanical) 0.15mm—6.35mm
Finish Hole(Mechanical) 0.10mm—6.30mm
Diameter Tolerance(Mechanical) 0.05mm
Registration(Mechanical) 0.075mm
Aspect Ratio 16 : 1
Solder Mask Type LPI
SMT Mini. Solder Mask Width 0.075mm
Mini. Solder Mask Clearance 0.05mm
Plug Hole Diameter 0.25mm—0.60mm
Impedance Control Tolerance ± 10%
Surface Finish HASL, ENIG, Chem.Tin, Chem Silver.Flash Gold, OSP, Gold finger