Fr4 Tg170 PCB
Fr4 Tg170 PCB, 2L, 0.8mm, Fr4 Tg170, 1oz, HAL Leadfree
Description
FR4 Tg170 PCB Capability:
| Item | Process Capability |
| Layer Counts | 1-24L |
| Description | 2L, 0.8mm, Fr4 Tg170, 1oz, HAL Leadfree |
| Material | FR-4,Ceramic,Alu Base, Cu Base, Rogers,etc. |
| Maximum Size | 600mm x 1500mm |
| Board Outline Tolerance | ± 0.10mm |
| Board Thickness | 0.20mm—8.00mm |
| Thickness Tolerance(t ≥ 0.8mm) | ± 8% |
| Thickness Tolerance(t < 0.8mm) | ± 10% |
| Insulation Layer Thickness | 0.075mm—5.00mm |
| Minimum Line | 0.075mm |
| Minimum Space | 0.075mm |
| Out Layer Copper Thickness | 18um—350mm |
| Inner Layer Copper Thickness | 17um—210mm |
| Drilling Hole(Mechanical) | 0.15mm—6.35mm |
| Finish Hole(Mechanical) | 0.10mm—6.30mm |
| Diameter Tolerance(Mechanical) | 0.05mm |
| Registration(Mechanical) | 0.075mm |
| Aspect Ratio | 16 : 1 |
| Solder Mask Type | LPI |
| SMT Mini. Solder Mask Width | 0.075mm |
| Mini. Solder Mask Clearance | 0.05mm |
| Plug Hole Diameter | 0.25mm—0.60mm |
| Impedance Control Tolerance | ± 10% |
| Surface Finish | HASL, ENIG, Chem.Tin, Chem Silver.Flash Gold, OSP, Gold finger |
