FPC & Rigid-flex
Quartz glass is widely used in semiconductor technology, new electric light sources, aerospace technology, far-infrared radiation heating equipment, optical instruments, optical communication, and military products. It has low thermal expansion coefficient, high temperature resistance, strong chemical stability, high UV and infrared transmission, high melting temperature, high viscosity, and difficult molding
Chemical Properties | |
Chemical formula/纯度 | 99.99% SiO2 |
Impurity content:(ug/g) | |
Al 32.0 Li 1.8 Fe 1.2 Ti 1.4 Ca 1.4 Ni 0.04 Mg 0.4 Cu 0.17 | |
K 1.10 B 0.39 Na 3.4 Cr 0.02 | |
Physical Properties | |
Density/密度 | 2.203g/cm³ |
Hardness/莫氏硬度 | 5.5-6.5 |
Microhardness/显微硬度 | 8000-9000 |
Tensile strength/拉伸强度 | 50/Mpa |
Compressive strength/耐压强度 | 67/Mpa |
Flexural strength/抗弯曲强度 | 3.98g/cm³ |
Bulk modulus/弹性模量Mpa | 72.5×10³ |
Rigidity modulus/刚性模量 | 3.1×10^10Pa(4.5×10^6psi) |
Poisson’s ratio/泊松比 | 0.17 |
Thermal Properties | |
Melting point/熔点 | 1215℃ |
Application temperature/应用温度 | 1120℃ |
Thermal expansion/热膨胀系数 | 5.5*10^-7cm/cm.℃ |
Strength/强度 | 5×10^7V/m |
Resistance/电阻 | 7×10^7ohm cm |
Fraction/折射率 | 1.4585 |
Reflection loss/反射损失 | 20% |
Tempered glass is a kind of pre-stressed glass that is reprocessed by glass. It has strong strength and tensile strength and is not easy to break. Its compressive strength can reach 125MPa or more, which is 4-5 times larger than ordinary glass. The impact strength is also very high. The 1kg steel ball falls from a height of 1m, and the glass can be kept intact.
Properties | |
Density/密度 | 2.47±0.03g/cm³ |
Young’s modulus/杨氏模量 | 75.6GPa |
Vickers hardness/维氏硬度 | 700HV |
Shear modulus/剪切模量 | 30.7GPa |
Poisson’s ratio/泊松比 | 0.23 |
Softening Point/软化点 | 830±10℃ |
Annealing point/退火点 | 606±10℃ |
strain point/应变点 | 558±10℃ |
Thermal expansion/热膨胀系数 | 98.0±2Í10-7/℃ |
■ Optical Properties光学性能
· Fraction/折射率 / 1.51
· 光弹性系数photoelastic coefficient nm/cm/MPa 27.2
· 透光率Transmittance(see below picture, sample thickness 0.55mm)
■强化性能 strength Performance
※Panda-MN228化学强化效率表Chemical Strengthening Efficiency Table
温度 时间 | 4h | 5h | 6h | |||
CS | DOL | CS | DOL | CS | DOL | |
400 | 840 | 32 | 830 | 37 | 820 | 41 |
405 | 833 | 35 | 823 | 40 | 813 | 43 |
410 | 826 | 38 | 816 | 42 | 806 | 46 |
415 | 818 | 40 | 808 | 45 | 798 | 49 |
420 | 806 | 42 | 800 | 47 | 788 | 53 |
备注 | 可根据需要选择强化条件。 (以上Na+浓度:1000˜1500PPM) |
Thickness | CS(MPa) | DOL(μm) | CT(MPa) | 备注 |
0.40T | ≥650 | ≥30 | ≤95 | 摄像头盖板建议:CS≥700MPa; DOL:24±5μm |
0.50T | ≥35 | ≤88 | 2.5D时建议: CS≥700MPa; DOL至少在35μm以上。 | |
0.55T | ≥35 | ≤82 | ||
0.70T | ≥35 | ≤62 | ||
0.80T | ≥37 | ≤55 | ||
0.90T | ≥40 | ≤50 | ||
1.00T | ≥40 | ≤47 | ||
1.30T | ≥40 | ≤44 | ||
1.50T | ≥40 | ≤40 | ||
1.80T | ≥40 | ≤37 | ||
2.00T | ≥40 | ≤35 |
※Sample size:145Í73Í0.70mm,The strength performance below:
·四点弯曲 MPa ≥500 (2.5D时建议≥600)
____下跨距:40mm,上跨距:20mm,下压速度10mm/min。
·落球性能 J ≥0.30
·翘曲度 mm ≤0.15
■耐化性能Chemical resistance
Chemical | 浓度(%) | Time | Tem(℃) | 质量Lost(mg/cm2) |
NaOH | 5% | 6h | 95±0.5 | 0.75 |
HCI | 5% | 24h | 95±0.5 | 0.12 |
HF | 10% | 20min | 20±0.5 | 17.18 |
Sapphire glass has very good thermal properties, excellent electrical and dielectric properties, and is resistant to chemical corrosion. It has high temperature resistance, good thermal conductivity, high hardness, infrared transmission, and good chemical stability. Therefore, it is often used to replace other optical materials to make optical components, infrared-transmitting optical windows, and is widely used in infrared and far-infrared military equipment, such as: used in night vision infrared and far-infrared sights, night vision cameras and other instruments And satellite and space technology instruments and meters, as well as windows for high-power lasers, various optical prisms, optical windows, UV and IR windows and lenses, observation ports for low-temperature experiments, and high-precision instruments for navigation, aerospace, and aviation. Be fully applied.
Chemical Properties | |
Chemical formula/纯度 | 99.997Al2O3 |
Physical Properties | |
Crystal structure/晶胞参数 | a=4.785Å, c=12.991Å |
Density/密度 | 3.98g/cm³ |
Hardness/莫氏硬度 | 9 |
Tensile strength/拉伸强度 | [email protected]℃, [email protected]℃ |
Compressive strength/耐压强度 | [email protected]℃ |
Flexural strength/抗弯曲强度 | [email protected]℃ |
Young’s modulus/杨氏模量 | [email protected]℃ |
Compressive modulus/压缩模量 | [email protected]℃ |
Flexural modulus/弯曲模量 | Flexural modulus/弯曲模量 |
Rigidity modulus/刚性模量 | [email protected]℃ |
Bulk modulus/体积弹性模量 | [email protected]℃ |
Poisson’s ratio/泊松比 | 0.29 |
Frictional coefficient/摩擦系数 | 蓝宝石-钢:0.15, 蓝宝石-蓝宝石:0.1 |
Thermal Properties | |
Melting point/熔点 | 2045℃ |
Application temperature/应用温度 | 2000℃ |
Thermal expansion/热膨胀系数 | 5.8*10-6/k |
Heat capacity/热容量 | 18.6cal(Mol•℃), (25℃), 30cal (Mol•℃), (1000℃) |
Thermal conductivity/热导率 | 25.12W/m/k (@100℃) |
Specific heat/比热 | 0.418W.s/g/k |
Optical Properties | |
Fraction/折射率 | no=1.768 ne=1.760 |
Optical transmission/波段 | 0.3~5μm |
Reflection loss/反射损失 | 20% |
Electrical Properties | |
Electrical resistivity/电阻率 | 绝缘 |
Dielectric constant/介电常数 | 11.5(11.5//c),9.3(⊥c) |
Dielectric strength/电介质强度 | 480kVcm-1 (60Hz |
Dielectric dissipation/电介质消耗 | 0.00006//与C轴, 0.00003⊥与C轴(10GHz) |
I am Peter Gong. I have been working in PCB and PCBA industry for 15+ years now. I have been a part of the PCB revolution with my dedication to circuit board technologies and creative ideas. I write in FX PCB to impart my knowledge on PCB and PCBA for all circuit board lovers, manufacturers, and users.
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