Description
Ceramic PCB AIO203 Capability:
| Board Thickness(mm) | 0.25/0.38/0.5/0.635/1.0/1.5/2.0/2.5/3.0mm |
| Layer Number | 1-2L |
| Base copper thickness(um) | 18-300um(0.5-8.5oz) |
| Min Track width/space(mm) | 0.075mm |
| Min hole size | 0.06mm(PTH) |
| Finished hole tolerance(mm) | 0.05mm(NPTH) |
| Outline Tolerance(mm) | 0.05mm |
| Hole Tolerance | +/-0.05mm |
| Min space from track to board edge | 0.2mm |
|
Finished board thickness |
(0.25-0.38mm)+/-0.03mm |
| (0.38-0.635)+/-0.04mm | |
| (0.76-2mm)+/-0.05mm | |
| Surface Treatment | ENIG,ENEPIG,Immersion Silver |
| Material | AIN, AI203 |
Ceramic PCB AIO203 Materials Properties:
| Item | Unit | Value | Test Standard |
| Color | / | White | 3.2 |
| Density | g/cm³ | ≥ 3.7 | GB/T 2413 |
| Thermal Conductivity | 20℃, W/(m · K) | ≥ 24 | GB/T 5598 |
| Dielectric Constant | 1MHz | 9~10 | GB/T 5594.4 |
| Dielectric Strength | KV/mm | ≥ 17 | GB/T 5593 |
| Flexural Strength | Mpa | ≥ 350 | GB/T 5593 |
| Camber | Length‰ | ≤2‰ | |
| Surface Roughness Ra | µ m | 0.2~0.75 | GB/T 6062 |
| Water Absorption | % | 0 | GB/T 3299—1996 |
| Volume Resistivity | 20℃, Ω .cm | ≥ 1014 | GB/T 5594.5 |
| Thermal Expansion | 10-6 mm 20~300℃ | 6.5~7.5 | GB/T 5593 |
