Description
Ceramic PCB Capability:
| Board Thickness(mm) | 0.25/0.38/0.5/0.635/1.0/1.5/2.0/2.5/3.0mm |
| Layer Number | 1-2L |
| Base copper thickness(um) | 18-300um(0.5-8.5oz) |
| Min Track width/space(mm) | 0.075mm |
| Min hole size | 0.06mm(PTH) |
| Finished hole tolerance(mm) | 0.05mm(NPTH) |
| Outline Tolerance(mm) | 0.05mm |
| Hole Tolerance | +/-0.05mm |
| Min space from track to board edge | 0.2mm |
| Finished board thickness | (0.25-0.38mm)+/-0.03mm |
| (0.38-0.635)+/-0.04mm | |
| (0.76-2mm)+/-0.05mm | |
| Surface Treatment | ENIG,ENEPIG,Immersion Silver |
| Material | AIN, AI203 |
Ceramic PCB Materials Properties:
| Item | Unit | Value | Test Standard |
| Color | / | Gray | 3.2 |
| Density | g/cm³ | ≥ 3.33 | GB/T 2413 |
| Thermal Conductivity | 20℃, W/(m · K) | ≥ 170 | GB/T 5598 |
| Dielectric Constant | 1MHz | 8~10 | GB/T 5594.4 |
| Dielectric Strength | KV/mm | ≥ 17 | GB/T 5593 |
| Flexural Strength | Mpa | ≥ 450 | GB/T 5593 |
| Camber | Length‰ | ≤2‰ | |
| Surface Roughness Ra | µ m | 0.3~0.6 | GB/T 6062 |
| Water Absorption | % | 0 | GB/T 3299—1996 |
| Volume Resistivity | 20℃, Ω .cm | ≥ 10¹³ | GB/T 5594.5 |
| Thermal Expansion | 10-6 mm 20~300℃ | 2~3 | GB/T 5593 |
FX PCB use the ceramic material imported from Germany and Fujian Huaqing, all incoming material will be strictly checked for the material properties. See the capability of FX PCB for the Ceramic.
