Description
The Thick Copper of Processing Capability:
| Item | Capability Classification | Mass Production | Sample Capacity |
| Structure | Grading Goldfinger | M | – |
| Gold finger length | M | – | |
| Steps gold finger | – | – | |
| Accuracy of critical dimension | Goldfinger zone thickness tolerance | +/-10% | +/-8％ |
| Chamfer | +/-5mil | +/-4mil | |
| Accuracy to shape | +/-3mil | – | |
| Accuracy to pattern | +/-1mil | +/-0.8mil | |
| Mixed compression | Type | 16 | 28 |
| Accuracy of graph | Line precision | +/-1mil | +/-0.8mil |
| Accuracy Of Buried Resistor | Buried resistance precision | +/- 10% | – |
| Counterpoint | Graph | ≤1.2mil | ≤1mil |
| Interlamination | +/-7mil | +/-6mil | |
| Line width /spacing | 3oz | 6/8 | 6/6 |
| 4oz | 8/8 | 7/6 | |
| 5oz | 8/10 | 8/8 | |
| 6oz | 12/12 | 10/10 | |
| 7oz | 12/14 | 12/12 | |
| 8oz | 12/16 | 12/16 | |
| 10oz | 12/18 | 12/18 | |
| 12oz | 12/20 | 12/20 | |
| Solder Mask | 4mil | 3.5mil | |
| 3-5oz Min Ring Width For Inner Layer | Aperture 1.0~1.5 | 12mil | – |
| Aperture 1.5~3.0 | 20mil | – | |
| Aperture 3.0~4.0 | 24mil | – | |
| Aperture >4.0 | 30mil | – | |
| Layer Count | 3oz | 20 layers | 24 layers |
| 4oz | 20 layers | 24 layers | |
| 5oz | 16 layers | 20 layers | |
| 6oz | 16 layers | 20 layers | |
| 7～12oz | 10 layers | 12 layers |
