Ceramic PCB for High Thermal Conductivity Circuits

Ceramic PCBs are available in a range of standard thicknesses: 0.25, 0.38, 0.5, 0.635, 1.0, 1.5, 2.0, 2.5, and 3.0 mm. Thickness tolerances vary by range — for example, boards between 0.25–0.38 mm carry a ±0.03 mm tolerance, while boards from 0.76–2 mm carry a ±0.05 mm tolerance. Custom thicknesses can be discussed based on your design requirements.

ALN (Aluminum Nitride) offers significantly higher thermal conductivity (≥170 W/m·K) and a thermal expansion coefficient of 2–3 × 10⁻⁶ mm/mm, closely matching semiconductor materials — ideal for high-power applications. Al2O3 (Alumina) has a lower thermal conductivity (≥24 W/m·K) but provides excellent volume resistivity (≥10¹⁴ Ω·cm) and is a cost-effective choice for general high-frequency and insulation-critical designs.

FX PCB offers three surface finish options for ceramic PCBs: ENIG (Electroless Nickel Immersion Gold), ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), and Immersion Silver. Each finish provides strong solderability and corrosion resistance, with ENEPIG being preferred for wire bonding applications and demanding aerospace or medical use cases.

DPC (Direct Plate Copper) is a manufacturing process where copper is directly deposited onto the ceramic substrate using physical vapor deposition followed by electroplating. This method eliminates microbubbles at the copper-ceramic interface, resulting in superior thermal conductivity, stronger adhesion, and finer circuit patterns — with a minimum track width/space of 0.075 mm.

Ceramic PCBs are used across industries requiring high thermal performance and electrical reliability: LED lighting and high-power LED modules, automotive electronics, aerospace and military components, high-frequency telecommunications equipment, power semiconductor modules, electronic heaters and coolers, and high-frequency switching power supplies are among the most common applications.

Yes. Ceramic PCBs feature a stable dielectric constant of 8–10 at 1 MHz, very low dielectric loss, and high volume resistivity (≥10¹³–10¹⁴ Ω·cm), making them well-suited for RF and high-frequency circuits. Their thermal stability and lack of organic components also ensure consistent electrical performance across wide temperature ranges, critical for telecommunications and microwave applications.