TG180 PCB Factories for High-Temperature Circuit Board Manufacturing

The numbers denote the glass transition temperature: Tg150 withstands up to ~150°C, Tg170 up to ~170°C, and Tg180 up to 180°C or above before the material begins to soften. Higher Tg ratings provide better dimensional stability, mechanical rigidity, and reliability in hotter environments. Tg180 is recommended for densely populated boards, lead-free soldering processes, and applications with prolonged thermal cycling.

Yes. TG180 PCBs are specifically suited for lead-free, RoHS-compliant soldering processes. Lead-free solder requires higher reflow temperatures (typically 250–260°C peak), which can stress standard Tg130 boards. The elevated glass transition temperature of Tg180 materials ensures the board remains stable and does not delaminate or warp during lead-free assembly, making them the preferred choice for RoHS-compliant manufacturing.

TG180 PCBs are widely used in aerospace and military electronics, medical devices and diagnostic equipment, industrial control systems, automotive electronics (including EV components), telecommunications infrastructure, and LED lighting systems. Any application that involves high operating temperatures, dense component populations, or lead-free assembly processes benefits from the enhanced thermal stability of Tg180 materials.

TG180 PCB materials exhibit significantly lower moisture absorption than standard FR4 laminates. Reduced moisture uptake minimizes the risk of delamination, signal integrity degradation, and mechanical failure — particularly in humid or moisture-prone operating environments. This characteristic makes Tg180 boards more reliable for outdoor industrial enclosures, medical equipment, and military applications where humidity control cannot always be guaranteed.

Yes. FX PCB manufactures Tg180 boards in multilayer configurations, supporting complex, high-density designs requiring multiple routing layers. Multilayer Tg180 PCBs are especially valuable for densely populated assemblies with small components where dimensional stability across thermal cycles is critical. Layer counts, stackup design, and impedance control requirements can be customized based on your specific application needs.

FX PCB holds ISO9001 (quality management), ISO14001 (environmental management), and ISO13485 (medical device manufacturing) certifications, alongside IPC-A-610 Class 2/3, RoHS, REACH, and UL compliance. These certifications cover the full manufacturing process from raw material selection through to finished board testing, ensuring TG180 PCBs meet the stringent quality and regulatory requirements of aerospace, medical, and industrial customers worldwide.