Thick Film Ceramic Substrates

SFX PCB offers thick film ceramic substrates in two primary materials: Aluminum Nitride (ALN), with thermal conductivity ≥170 W/(m·K), and Aluminum Oxide/Alumina (Al2O3), with thermal conductivity ≥24 W/(m·K). ALN is preferred for the most demanding thermal applications, while Al2O3 provides a cost-effective option with excellent electrical insulation.

Ceramic PCBs from SFX PCB are available with ENIG (Electroless Nickel Immersion Gold), ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), and Immersion Silver surface finishes. Each finish offers different levels of solderability, wire-bondability, and oxidation resistance to suit specific assembly and application requirements.

Thick film ceramic substrates are widely used in LED lighting, high-power semiconductor modules, automotive electronics, telecommunications, aerospace and military systems, and semiconductor packaging. Their combination of high thermal conductivity, zero water absorption, and resistance to cosmic rays makes them indispensable in high-reliability and harsh-environment electronics.

SFX PCB's ceramic PCBs support a minimum track width and space of 0.075 mm using DPC (Direct Plate Copper) manufacturing technology. This fine-line capability enables high-density circuit designs suitable for compact power modules, RF components, and precision semiconductor packaging.

Available board thicknesses range from 0.25 mm to 3.0 mm, including: 0.25, 0.38, 0.5, 0.635, 1.0, 1.5, 2.0, 2.5, and 3.0 mm. Thickness tolerances are tightly controlled — as precise as ±0.03 mm for thinner boards — to ensure dimensional consistency critical for thermal interface and packaging assembly.

Yes. SFX PCB supports the full product lifecycle from prototype through mass production for ceramic substrates. Every order includes free DFM (Design for Manufacturability) analysis, and the company accepts standard PCB design file formats including Gerber, CAM, Eagle, and Protel99. Contact the team via email or enquiry form to discuss your project requirements and timeline.