Ceramic PCB Manufacturer for High-Temperature Electronics

DPC (Direct Plate Copper) is a manufacturing process that deposits copper directly onto the ceramic substrate using thin-film and electroplating techniques, eliminating microbubbles found in traditional bonding methods. This results in superior thermal contact, better adhesion strength, and more reliable heat dissipation, which is critical for high-power semiconductor modules and LED applications.

FX PCB offers three surface finish options for ceramic PCBs: ENIG (Electroless Nickel Immersion Gold), ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), and Immersion Silver. Each finish provides excellent solderability and oxidation resistance. ENEPIG is particularly suitable for wire bonding applications in semiconductor packaging.

Ceramic PCBs are available in board thicknesses ranging from 0.25 mm to 3.0 mm across nine standard sizes. Base copper thickness ranges from 18 to 300 µm (0.5 to 8.5 oz), supporting standard, medium, and heavy copper weights. This flexibility accommodates both fine-signal and heavy-current power circuit designs.

Yes. Ceramic PCBs from FX PCB contain no organic ingredients and exhibit resistance to cosmic rays, making them compliant with stringent aerospace and military requirements. Material testing is conducted per Chinese national standards including GB/T 2413 and GB/T 5598, and the boards feature low dielectric loss and high volume resistivity essential for defense-grade reliability.

FX PCB achieves a minimum track width and spacing of 0.075 mm for ceramic PCBs, enabling fine-line designs for RF and high-density applications. Accepted design file formats include Gerber, CAM, Eagle, CAD, Protel99, 99se, and DXP, ensuring seamless integration with most PCB design workflows.

Yes. FX PCB supports the full production spectrum from single prototypes to high-volume mass production runs without requiring a supplier change. Official quotations are delivered within 24 hours of submitting design files, and free DFM (Design for Manufacturability) analysis is included with every order to prevent costly redesigns before production.