Multilayer PCB Manufacturing with Tight Tolerances

FX PCB achieves a minimum line width and spacing of 0.05mm on rigid FR4 boards. For 6-layer PCBs, the minimum is 0.07mm/0.07mm. Rigid-flex inner layers reach 1.5mil/1.5mil in low-volume production, and flex PCBs support 2.5mil/2.5mil inner layer line width and spacing for high-density designs.

Yes. Impedance control is supported across multilayer rigid, rigid-flex, and flex PCB products. Rigid-flex and flex boards achieve +/-10% impedance tolerance. Multilayer PCBs specifically support controlled impedance for high-speed digital and RF signal transmission, with layer stackup design guidance available from the engineering team.

FX PCB offers a comprehensive range of surface finishes including HASL, Pb-Free HASL, ENIG, Immersion Silver, Immersion Tin, Hard Gold, OSP, ENEPIG, and Soft Gold. The choice depends on solderability requirements, shelf life, application environment, and whether RoHS-compliant lead-free finishes are needed.

FX PCB holds ISO9001, ISO14001, and ISO13485 certifications. Manufacturing conforms to IPC guidelines and IPC-A-610 Class 2/3 assembly standards. Products are available with RoHS and REACH compliance. Rigid FR4 PCBs carry UL listing, and multilayer rigid-flex boards are produced to IPC Class II quality standards with full electrical and impedance testing.

Supported base materials include standard and High Tg FR4 (Tg150, Tg170, Tg180), Rogers RO4000 series for RF and high-frequency applications, polyimide for flex and rigid-flex boards, ceramic substrates (ALN and Al2O3), aluminum and copper for metal core PCBs, and glass substrates for advanced packaging and 5G/6G applications.

Standard production lead time for multilayer PCBs is 5–10 business days, with expedited services available upon request. Quotations are provided within 24 hours of Gerber file submission. Turnkey PCBA prototypes can be assembled from 24 hours once all components are available. Stack-up and pricing for rigid-flex boards are delivered within 8 hours.