Ceramic PCBs

FX PCB's Ceramic PCBs are available with ENIG (Electroless Nickel Immersion Gold), ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), and Immersion Silver surface finishes. ENIG and ENEPIG are popular for wire bonding and semiconductor packaging applications, while Immersion Silver offers excellent solderability for high-frequency circuits.

Standard board thicknesses available are 0.25, 0.38, 0.5, 0.635, 1.0, 1.5, 2.0, 2.5, and 3.0 mm. Thickness tolerances range from ±0.03 mm for thinner boards to ±0.05 mm for boards up to 2 mm, ensuring precise fit in demanding electronic assemblies.

Ceramic PCBs are available with base copper thickness ranging from 18 µm to 300 µm (approximately 0.5 oz to 8.5 oz). This covers standard, medium, and heavy copper weights, making them suitable for low-signal traces all the way to high-current power electronics and thermal management applications.

Yes. FX PCB's Ceramic PCBs contain no organic ingredients, providing inherent resistance to cosmic radiation. They also comply with Chinese national material standards (GB/T series) and are tested for high dielectric strength (≥17 KV/mm), making them well-suited for aerospace, military electronics, and space-grade component packaging.

The minimum track width and spacing is 0.075 mm, supporting fine-line circuit designs required in RF and high-density power modules. The minimum PTH hole size is 0.06 mm, with hole tolerances of ±0.05 mm, enabling precise interconnects across 1–2 layer ceramic board configurations.

FX PCB accepts Gerber, CAM, Eagle, CAD, Protel99, 99SE, and DXP design file formats for seamless order processing. Pre-sales technical consultation is also available via email and contact form, and the team provides free DFM analysis on every order to catch design issues before fabrication begins.