Multilayer PCB Assembly with SMT & Through-Hole

Multilayer PCBs are built by stacking alternating layers of copper traces and insulating prepreg material, then laminating them under heat and pressure. The process includes inner-layer patterning via photolithography and chemical etching, mechanical or laser drilling for vias, copper plating for interconnection, outer-layer etching, solder mask application, surface finishing (e.g., ENIG, HASL), and final electrical testing and inspection.

Surface Mount Technology (SMT) places components directly onto pads on the board surface using solder paste and reflow soldering — ideal for compact, high-density designs. Through-hole assembly inserts component leads through drilled holes and solders them on the opposite side, providing stronger mechanical bonds for connectors, transformers, and components subject to stress or high current.

FX PCB holds ISO 9001 certification for quality management systems, ISO 13485 certification for medical device manufacturing, and IPC-A-610 Class 2/3 certification for the acceptability of electronic assemblies. These certifications ensure that assemblies meet rigorous quality and reliability standards across industries including medical, aerospace, and defense.

FX PCB supports a full spectrum of board types and substrates, including rigid FR4, flexible polyimide (FPC), rigid-flex, metal core (aluminum and copper), ceramic (ALN and Al2O3), Rogers, and transparent glass PCBs. Board construction types include rigid, flexible, rigid-flex, metal core, and hybrid configurations to serve diverse application requirements.

Yes. FX PCB supports seamless scaling from prototype to mass production with a single manufacturing partner. Assembled prototypes can be turned around in as little as 24 hours once all components are available, while standard production lead times for multilayer PCBs are typically 5–10 business days. Free DFM (Design for Manufacturability) analysis is included on every order to support this transition.

FX PCB's multilayer PCB assembly services support a wide range of industries, including telecommunications (5G/6G base stations, RF equipment), medical devices (X-ray, MRI, heart monitors, defibrillators), aerospace and defense (radar, military avionics, satellite systems), automotive electronics (EV power modules, ABS systems, control units), and industrial electronics, serving customers worldwide.

FX PCB performs 100% electrical testing on every bare board, along with Automated Optical Inspection (AOI), X-Ray inspection for hidden solder joints (e.g., BGAs), impedance testing, solderability testing, appearance and dimension inspection, and functional testing (FCT) where required. All assemblies are inspected against IPC-A-610 Class 2 or Class 3 standards before shipment.